Heiko Aßmann

Title: Heiko Aßmann: Innovator in Semiconductor Technology

Introduction

Heiko Aßmann is a prominent inventor based in Dresden, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His innovative work focuses on enhancing the functionality and efficiency of semiconductor chips.

Latest Patents

Aßmann's latest patents include a method for generating chip-specific identification code marks on semiconductor chips. This method involves patterning a resist layer over a semiconductor wafer through laser direct image exposure. The process includes writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer, followed by the development of the patterned resist layer. Another notable patent is a method for producing a self-aligning masking layer. This method entails forming a buried electrically charged region at a predefined position in a first layer, generating an electric field with a lateral inhomogeneous field distribution above the first layer. The second layer is then formed above the first layer, correlating its structure with the position of the buried electrically charged region.

Career Highlights

Heiko Aßmann is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the industry.

Collaborations

Aßmann collaborates with talented individuals such as Felix Braun and Marcus Dankelmann. Their teamwork fosters an environment of innovation and creativity, leading to groundbreaking developments in semiconductor technology.

Conclusion

Heiko Aßmann's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the future of semiconductor applications.