Infineon Technologies Ag

Heiko Aßmann

Jens Schneider

Ralf Rudolf

Felix Braun

Andreas Greiner

Detlef Hofmann

Marcus Dankelmann

Stefan Doering

Karsten Friedrich

Udo Goetschkes

A method of generating chip-specific identification code marks on semiconductor chips includes patterning a resist layer over a semiconductor wafer by laser direct image exposure, the patterning including writing chip-specific identification codes into the resist layer over chip areas of the semiconductor wafer. The patterned resist layer is then developed.

Identification codes on semiconductor chips

In various embodiments, a method is provided. The method may include forming a buried electrically charged region at a predefined position in a first layer in such a way that the buried electrically charged region generates an electric field having a lateral inhomogeneous field distribution above the first layer, and forming a second layer above the first layer using the field distribution in such a way that a structure of the second layer correlates with the position of the buried electrically charged region.

Method for producing a self-aligning masking layer

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Dresden, Germany

Heiko Aßmann