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For the Inventor, By the Inventor

Brackney, PA, United States of America

Heike Marcello

USPTO Granted Patents = 10

Average Co-Inventor Count = 3.7

ph-index = 5

Forward Citations = 71(Granted Patents)


Company Filing History:

goldMedal10 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1999-2004

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10 patents (USPTO):
1. 6835533 - Photoimageable dielectric epoxy resin system film (2004-12-28),
2. 6706464 - Method of fabricating circuitized structures (2004-03-16),
3. 6680440 - Circuitized structures produced by the methods of electroless plating (2004-01-20),
4. 6528218 - Method of fabricating circuitized structures (2003-03-04),
5. 6519843 - Method of forming a chip carrier by joining a laminate layer and stiffener (2003-02-18),
6. 6376158 - Methods for selectively filling apertures (2002-04-23),
7. 6195264 - Laminate substrate having joining layer of photoimageable material (2001-02-27),
8. 6066889 - Methods of selectively filling apertures (2000-05-23),
9. 6025057 - Organic electronic package and method of applying palladium-tin seed (2000-02-15),
10. 5866237 - Organic electronic package and method of applying palladium-tin seed (1999-02-02),

Title: Heike Marcello: Innovator in Circuitized Substrate Technology

Introduction

Heike Marcello is a prominent inventor based in Brackney, PA (US). She has made significant contributions to the field of circuitized substrate technology, holding a total of 10 patents. Her innovative work focuses on developing methods that enhance the fabrication of circuitized substrates, which are essential in various electronic applications.

Latest Patents

Heike's latest patents include a groundbreaking photoimageable dielectric epoxy resin system film. This method fabricates circuitized substrates that reduce shorts and eliminate the need for baking. The film employs a photoimageable dielectric film with a solvent content of less than about 5% and a glass transition temperature greater than about 110°C when cured. The film consists of 95% to 100% solids, including a particulate rheology modifier and an epoxy resin system. Another notable patent is the method of fabricating circuitized structures, which shares similar innovative features aimed at improving substrate fabrication processes.

Career Highlights

Heike Marcello is currently associated with the International Business Machines Corporation (IBM). Her work at IBM has positioned her as a key player in the development of advanced materials for electronic applications. Her patents reflect her commitment to innovation and her ability to solve complex engineering challenges.

Collaborations

Heike has collaborated with notable coworkers, including David John Russell and Gerald Walter Jones. These collaborations have further enriched her work and contributed to the advancement of technology in her field.

Conclusion

Heike Marcello's contributions to circuitized substrate technology exemplify her innovative spirit and dedication to advancing electronic materials. Her patents not only showcase her expertise but also pave the way for future developments in the industry.

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