Chiba, Japan

Heiemon Akiyama

This inventor holds 4 USPTO granted patents. Top assignees: Tokyo Automatic Machinery Works, Ltd., Toyko Automatic Machinery Works, Ltd.. Active years: 1990-1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Heiemon Akiyama. Retrieved from https://idiyas.com/inventor/heiemon-akiyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.3

ph-index = 3

Forward Citations = 25(Granted Patents)


Company Filing History:


Years Active: 1990-1996

Loading Chart...
4 patents (USPTO):Explore Patents

Title: Heiemon Akiyama - Innovator in Packaging Technology

Introduction

Heiemon Akiyama is a notable inventor based in Chiba, Japan, recognized for his contributions to packaging technology. With a total of four patents to his name, Akiyama has developed innovative solutions that enhance the efficiency and effectiveness of packaging processes.

Latest Patents

Akiyama's latest patents include:

1. **Flap folding device of wrapping machine** - This invention involves a mechanism where side folding guides approach side flaps to press a wrapped body part against closed side faces, allowing for precise folding along corners.

2. **Method for packaging contents and packaging device** - This patent describes a packaging apparatus that applies a packaging sheet to cover contents while simultaneously sealing them, featuring an adhering mechanism that ensures effective sealing at designated positions.

Career Highlights

Throughout his career, Akiyama has worked with prominent companies such as Tokyo Automatic Machinery Works, Ltd., where he honed his skills in machinery and packaging technology. His experience in these roles has significantly influenced his innovative approach to packaging solutions.

Collaborations

Akiyama has collaborated with esteemed colleagues, including Minoru Sato and Norio Masubuchi, contributing to advancements in the field of packaging technology through teamwork and shared expertise.

Conclusion

Heiemon Akiyama's inventive spirit and

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…