This inventor holds 2 USPTO granted patents and 1 published patent application and 3 EPO patents. Top assignees: Guangdong Midea White Home Appliance Technology Innovation Center Co., Ltd., Midea Group [Shanghai] Co., Ltd., Midea Group Co., Ltd.. Active years: 2023-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 2023-2026
Title: Hecheng Liu: Innovator in Heat Exchange Technology
Introduction
Hecheng Liu is a notable inventor based in Foshan, China. He has made significant contributions to the field of heat exchange technology, with a focus on devices that enhance efficiency in various applications. Liu holds 2 patents that showcase his innovative approach to engineering.
Latest Patents
Liu's latest patents include a heat exchange device and a mobile air conditioner. The heat exchange device features an evaporator, two liquid storage tanks, and a power unit designed to facilitate the circular flow of a liquid medium. This design aims to improve the efficiency of heat transfer in various systems. The mobile air conditioner incorporates a first heat exchanger and a phase-change energy storage heat exchange device, allowing for effective refrigerant management and energy storage.
Career Highlights
Throughout his career, Hecheng Liu has worked with prominent companies such as Midea Group Co., Ltd. and Midea Group [Shanghai] Co., Ltd. His experience in these organizations has allowed him to develop and refine his innovative ideas in heat exchange technology.
Collaborations
Liu has collaborated with talented individuals in his field, including Chen Lin and Bao Yue. These partnerships have contributed to the advancement of his projects and the successful development of his patents.
Conclusion
Hecheng Liu is a distinguished inventor whose work in heat exchange technology has led to practical innovations. His contributions continue to impact the industry positively, showcasing the importance of creativity and collaboration in engineering.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile