Taipei, Taiwan

He-Ming Wu

This inventor holds 1 USPTO granted patent. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: He-Ming Wu. Retrieved from https://idiyas.com/inventor/he-ming-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: He-Ming Wu and His Camera Module Invention.

Introduction

He-Ming Wu is an inventor associated with Taipei, Taiwan. His patent work includes a camera module designed to protect and support components around an image sensor.

Latest Patents

Wu is credited with 1 patent: “Camera Module Having Colloid Layer Surrounding Sensor.” The invention describes a camera module with a lens module and a base carrying a sensor. At least two supporting protrusions extend from the base and contact the lens module to hold it in place. A colloid layer surrounds the sensor and is positioned between the holder and the base, covering electronic components on the circuit board.

Career Highlights

Wu’s listed patent is associated with Hon Hai Precision Industry Co., Ltd. It focuses on camera-module construction, including lens support and a protective colloid layer around the sensor and circuit-board components.

Collaborations

Fu-Chieh Chan and Shin-Wen Chen are identified as Wu’s coworkers. Their shared association with Hon Hai Precision Industry Co., Ltd. provides context for the professional environment connected with his patent.

Conclusion

He-Ming Wu’s patent documents a camera-module design that combines structural lens support with a colloid layer protecting the sensor area and electronic components.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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