This inventor holds 1 USPTO granted patent and 23 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Haseob Seong - Innovator in Semiconductor Packaging
Introduction
Haseob Seong is an inventor based in Suwon-si, South Korea. He is known for his innovative work in the field of semiconductor packaging. Although he currently holds no granted patents, his contributions to the industry are noteworthy.
Latest Patent Applications
Haseob Seong has submitted several patent applications related to semiconductor packages. One of his applications describes a semiconductor package that includes a lower semiconductor chip with a top and bottom surface, an upper semiconductor chip positioned on the top surface of the lower chip, and a dielectric layer situated between them. The design features a connection structure that connects both semiconductor chips, ensuring efficient functionality. Another application outlines a semiconductor package that incorporates a chip stack with first semiconductor chips and a second semiconductor chip on the uppermost first chip. This design includes an upper cover member, an intermediate insertion member, and a dam structure, all contributing to the overall integrity and performance of the semiconductor package.
Conclusion
Haseob Seong's work in semiconductor packaging showcases his innovative spirit and dedication to advancing technology. His latest patent applications reflect his commitment to improving semiconductor designs, even as he seeks to secure granted patents in the future.