Harvey Kong

Title: The Innovative Mind of Harvey Kong

Introduction

Harvey Kong is a notable inventor based in Singapore, SG. He has made significant contributions to the field of semiconductor packaging. His innovative approach has led to the development of a unique method and apparatus that enhances the efficiency of stacked die packaging.

Latest Patents

Harvey Kong holds a patent for a "Method and apparatus for stacked die packaging." This invention provides a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper semiconductor die. The pillar is formed integrally with and of the same material as the leadframe. It is sized to have a predetermined height that exceeds the height of the lower semiconductor die, the height of bonding wires for the lower semiconductor die, and a predetermined spacing between the bonding wires and the bottom of the upper semiconductor die.

Career Highlights

Harvey Kong is currently employed at St Assembly Test Services Inc., where he continues to innovate in the semiconductor industry. His work focuses on improving packaging methods that are crucial for the performance and reliability of electronic devices.

Collaborations

Harvey collaborates with various professionals in his field, including his coworker, Virgil Cotoco Ararao. Their combined expertise contributes to the advancement of semiconductor technologies.

Conclusion

Harvey Kong's contributions to semiconductor packaging through his innovative patent demonstrate his commitment to enhancing technology in this field. His work continues to influence the industry positively.