Company Filing History:
Years Active: 2022
Title: Harunobu Suenaga: Innovator in Silicon Oxide Bonding Technology
Introduction
Harunobu Suenaga is a notable inventor based in Koshi, Japan. He has made significant contributions to the field of materials science, particularly in the area of silicon oxide bonding technology. His innovative approach has led to advancements that are crucial for various applications in semiconductor manufacturing.
Latest Patents
Suenaga holds a patent for a method and structure for low density silicon oxide for fusion bonding and debonding. This patent describes a method of bonding and/or debonding substrates, where at least one of the surfaces of the substrates to be bonded is comprised of an oxide. In one embodiment, both substrates have surfaces that comprise an oxide. A wet etch may be utilized to debond the substrates by etching away the layers that have been bonded. The patent highlights the use of a fusion bonding process, where at least one substrate has a silicon oxide surface. An exemplary etch involves a dilute hydrofluoric (DHF) etch, which allows for the debonding of two bonded substrates. The innovation also emphasizes the use of low density silicon oxide in the bonding process.
Career Highlights
Harunobu Suenaga is associated with Tokyo Electron Limited, a leading company in the semiconductor industry. His work has been instrumental in developing technologies that enhance the efficiency and effectiveness of semiconductor manufacturing processes. Suenaga's expertise in silicon oxide bonding has positioned him as a key figure in his field.
Collaborations
Suenaga has collaborated with notable colleagues, including Kiyotaka Imai and Hirokazu Aizawa. These collaborations have contributed to the advancement of technologies in the semiconductor sector.
Conclusion
Harunobu Suenaga's contributions to silicon oxide bonding technology reflect his innovative spirit and dedication to advancing materials science. His patent and work at Tokyo Electron Limited underscore his importance in the semiconductor industry.