Haruna Oya

Introduction

Haruna Oya is an inventive force based in Shiga, Japan, known for her contributions to the field of printed wiring boards. With a notable patent to her name, Oya has made significant strides in enhancing the efficiency and functionality of this crucial technology.

Latest Patents

Oya holds a patent for a printed wiring board that features an innovative design. The patented technology includes an insulating substrate layer, a first conductive layer laminated to one surface of the substrate layer, and a second conductive layer laminated to the opposite surface. A unique aspect of her design is the via hole that electrically couples the first and second conductive layers, maintaining functionality even with an irregular-shaped cross-section of the connection hole, enhancing the board's versatility and reliability.

Career Highlights

Throughout her career, Haruna Oya has gained valuable experience at leading companies in the industry. She has worked with Sumitomo Electric Printed Circuits, Inc. and Sumitomo Electric Industries, Limited, where she played a key role in developing cutting-edge technologies and products in the printed wiring board sector.

Collaborations

Oya's innovative journey has been enriched by collaborations with notable professionals in the field, including her coworkers Tadahiro Kaibuki and Daisuke Sato. These partnerships have enabled her to leverage collective expertise and further her innovations within the industry.

Conclusion

Haruna Oya's contributions to the printed wiring board technology continue to impact the field positively. Her inventive spirit and dedication to advancement signify her importance in the realm of technology and innovation. With her patent and career accomplishments, Oya serves as an inspiring figure for future generations of inventors.