Kariya, Japan

Haruki Shingo

This inventor holds 1 USPTO granted patent. Top assignee: Denso Aircool Corporation. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haruki Shingo. Retrieved from https://idiyas.com/inventor/haruki-shingo

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Haruki Shingo: Innovator in Heat Exchanger Technology

Introduction

Haruki Shingo is a notable inventor based in Kariya, Japan. He has made significant contributions to the field of heat exchanger technology. His innovative designs and methods have the potential to enhance efficiency in various applications.

Latest Patents

Haruki Shingo holds a patent for a heat exchanger and method for producing the same. This invention includes multiple aluminum heat transfer tubes through which a heat medium flows, along with multiple aluminum connection pipes brazed to the end portions of the heat transfer tubes. A heat equalizing member, formed of a heat conductor, is designed to be in contact with at least two of the connection pipes, facilitating heat transfer between them. The method for producing this heat exchanger involves brazing the heat transfer tubes to the connection pipes while the heat equalizing member is in contact with the connection pipes.

Career Highlights

Haruki Shingo is currently employed at Denso Aircool Corporation, where he continues to innovate in the field of heat exchangers. His work has been instrumental in advancing the technology used in various cooling and heating systems.

Collaborations

Some of his coworkers include Takefumi Hosono and Akira Yanagida, who contribute to the collaborative environment at Denso Aircool Corporation.

Conclusion

Haruki Shingo's contributions to heat exchanger technology exemplify the impact of innovative thinking in engineering. His patent reflects a commitment to improving efficiency and functionality in thermal management systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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