Dallas, TX, United States of America

Harshpreet Bakshi

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Texas Instruments Corporation. Active years: 2026.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Harshpreet Bakshi: Innovator in Microelectronic Packaging

Introduction

Harshpreet Bakshi is a notable inventor based in Dallas, TX (US). He has made significant contributions to the field of microelectronics, particularly in the design and development of innovative packaging solutions. His work is characterized by a focus on enhancing the performance and efficiency of microelectronic devices.

Latest Patents

Harshpreet Bakshi holds a patent for a microelectronic package with an antenna waveguide. This invention includes a waveguide radiation receiver formed in a first conductor layer of a multilayer package substrate. The multilayer package substrate comprises the first conductor layer spaced from a second conductor layer by a dielectric layer. Additionally, the microelectronic package features a tubular waveguide mounted to the multilayer package substrate, ensuring that a central aperture of the tubular waveguide is positioned over the waveguide radiation receiver. A feed line couples the waveguide radiation receiver to a transmitter-receiver, with a conductive via traversing the dielectric layer to electrically connect different portions of the feed line.

Career Highlights

Harshpreet Bakshi is currently employed at Texas Instruments Corporation, where he continues to innovate in the field of microelectronics. His work at Texas Instruments has allowed him to collaborate with other talented professionals and contribute to cutting-edge technology.

Collaborations

One of his notable coworkers is Yiqi Tang, with whom he has likely shared insights and expertise in their respective fields.

Conclusion

Harshpreet Bakshi is a distinguished inventor whose work in microelectronic packaging has the potential to influence the future of technology. His patent for a microelectronic package with an antenna waveguide exemplifies his innovative spirit and dedication to advancing the field.

Profile summary based on public USPTO records.
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