This inventor holds 1 USPTO granted patent. Top assignee: The Mica Corporation. Active years: 1984.
Company Filing History:
Years Active: 1984
Title: Harshad K Patel: Innovator in Multi-Layered Circuit Board Technology
Introduction
Harshad K Patel is a notable inventor based in Los Angeles, CA. He has made significant contributions to the field of electronics through his innovative designs and patents. His work primarily focuses on the development of advanced circuit board technologies.
Latest Patents
Harshad K Patel holds a patent for a multi-layered circuit board. This invention features a layered clad laminate with a universal center plane, designed for the manufacture of printed wiring boards. The patent describes an electrically conductive self-sustaining, integral metal center sheet that includes a series of predetermined patterns of punched or photochemically developed openings. This sheet is pressed between electrical insulating layers of resin-impregnated reinforcing material. The layers are adhered to the sheet and to each other through the openings, with a layer of electrically conductive metal foil on each outer surface of the laminate.
Career Highlights
Harshad K Patel is currently employed at The Mica Corporation, where he continues to innovate and develop new technologies. His work has been instrumental in advancing the capabilities of circuit board manufacturing.
Collaborations
Harshad collaborates with Andjelko Illick, contributing to various projects and enhancing the technological advancements within their field.
Conclusion
Harshad K Patel's contributions to the field of electronics, particularly through his patent for a multi-layered circuit board, highlight his innovative spirit and dedication to advancing technology. His work at The Mica Corporation continues to influence the industry positively.