Harry J Jones

Title: Innovations by Harry J Jones

Introduction

Harry J Jones is a notable inventor based in Austin, TX, who has made significant contributions to the field of electronic packaging. With a total of 4 patents, his work focuses on advanced bonding techniques and electronic circuit designs that enhance the efficiency and functionality of electronic devices.

Latest Patents

Among his latest patents, Jones has developed a Balltape structure for tape automated bonding and multilayer packaging. This innovation involves automated bonding of chips to tape and the formation of bonding structures on Tape Automated Bonding (TAB) packaging structures. The bonding balls are strategically aligned on stacked TAB sheets, allowing for interconnections through stacked balltape balls in multilayer electronic packaging structures. Additionally, he has designed an electronic module that minimizes the number of EC pads required, enabling efficient connections between chip receiver and driver circuits.

Career Highlights

Jones is currently employed at International Business Machines Corporation (IBM), where he continues to push the boundaries of technology through his innovative designs. His work has been instrumental in advancing the capabilities of electronic packaging and circuit design.

Collaborations

Throughout his career, Jones has collaborated with esteemed colleagues such as Harsaran S Bhatia and Shashi D Malaviya, contributing to various projects that have furthered the field of electronics.

Conclusion

Harry J Jones is a prominent inventor whose work in electronic packaging and circuit design has led to significant advancements in the industry. His innovative patents and collaborations reflect his commitment to enhancing technology and improving electronic devices.