Austin, TX, United States of America

Harry J Goldlen

This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 1996.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Harry J Goldlen. Retrieved from https://idiyas.com/inventor/harry-j-goldlen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 1996

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1 patent (USPTO):Explore Patents

Title: The Innovations of Harry J. Goldlen

Introduction

Harry J. Goldlen is a notable inventor based in Austin, Texas. He has made significant contributions to the field of electronics through his innovative patent. His work primarily focuses on improving soldering methods for electronic components.

Latest Patents

Goldlen holds a patent for a new flux composition and corresponding soldering method. This invention includes a unique flux composition that incorporates pimelic acid and two organic solvents. Notably, this new flux composition leaves essentially no ionic residues after the soldering processes used to mount electronic components onto printed circuit boards. This advancement is crucial for enhancing the reliability and performance of electronic devices.

Career Highlights

Goldlen is associated with the International Business Machines Corporation, commonly known as IBM. His role at IBM has allowed him to work on cutting-edge technologies and contribute to the advancement of electronic manufacturing processes. His patent reflects his commitment to innovation and excellence in the field.

Collaborations

Some of Goldlen's coworkers include Roy Lynn Arldt and Susan H. Downey. Their collaboration within IBM has fostered an environment of creativity and technological advancement.

Conclusion

Harry J. Goldlen's contributions to the field of electronics through his innovative patent demonstrate his expertise and dedication. His work continues to influence the industry, paving the way for future advancements in soldering methods and electronic component assembly.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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