Bethesda, OH, United States of America

Harry E Danford

This inventor holds 1 USPTO granted patent. Top assignee: Touchstone Research Laboratory, Ltd.. Active years: 2012.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 6(Granted Patents)


Company Filing History:


Years Active: 2012

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1 patent (USPTO):Explore Patents

Title: The Innovations of Harry E. Danford

Introduction

Harry E. Danford is an accomplished inventor based in Bethesda, Ohio. He has made significant contributions to the field of materials science, particularly with his innovative work on infiltrated carbon foam composites. His expertise and creativity have led to advancements that may have important applications in thermal protection systems.

Latest Patents

Danford holds a patent for an infiltrated carbon foam composite. This invention describes a composite that includes a carbonized carbon aerogel within the cells of a carbon foam body. A resin is infiltrated into the carbon foam body, filling the cells and spaces around the carbonized carbon aerogel. This composite is particularly useful for mid-density ablative thermal protection systems, showcasing Danford's ability to address complex engineering challenges.

Career Highlights

Danford is associated with Touchstone Research Laboratory, Ltd., where he has been able to apply his innovative ideas in a collaborative environment. His work has not only contributed to the laboratory's reputation but has also advanced the field of materials science.

Collaborations

Throughout his career, Danford has worked alongside talented individuals such as Janusz Wladyslaw Plucinski and Jesse M. Blacker. These collaborations have fostered a creative atmosphere that encourages the development of groundbreaking technologies.

Conclusion

Harry E. Danford's contributions to the field of materials science, particularly through his patent on infiltrated carbon foam composites, highlight his innovative spirit and dedication to advancing technology. His work continues to inspire future developments in thermal protection systems.

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