Company Filing History:
Years Active: 2002
Title: Harry Cheng Hong Kam: Innovator in Leadless Packaging Technology
Introduction
Harry Cheng Hong Kam is a notable inventor based in Melaka, Malaysia. He has made significant contributions to the field of integrated circuit packaging, particularly through his innovative designs that enhance performance and efficiency. With a total of 2 patents, his work has garnered attention in the semiconductor industry.
Latest Patents
Harry's latest patents include advancements in low inductance leadless packages. This invention describes a variety of leadless packaging arrangements and methods for packaging integrated circuits that are designed to have relatively low inductance. One aspect of this patent involves a leadless semiconductor package featuring an exposed die pad and multiple exposed contacts formed from a common substrate material. The die attach pad is thinned compared to the contacts, allowing for reduced bonding wire lengths, which in turn minimizes inductance. Additionally, a plastic cap is molded over the die and contacts, encapsulating the bonding wires while keeping the bottom surface of the contacts exposed.
Another significant patent focuses on electrical isolation in panels of leadless integrated circuit packages. This invention outlines techniques for electrically debussing conductive substrate panels used in the formation of a matrix of leadless packages. After fabricating the matrix on a conductive substrate, tie bars supporting the contacts are removed post-molding of plastic caps, ensuring electrical isolation while maintaining structural integrity for handling. This method allows for panel-based testing and separation of packaged devices using conventional techniques.
Career Highlights
Harry Cheng Hong Kam is currently employed at National Semiconductor Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing the capabilities of leadless packaging solutions.
Collaborations
Throughout his career, Harry has collaborated with notable colleagues, including Jaime A Bayan and Peter Howard Spalding. These collaborations have contributed to the development of cutting-edge technologies in the semiconductor industry.
Conclusion
Harry Cheng Hong Kam is a distinguished inventor whose contributions to leadless packaging technology have made a significant impact in the semiconductor field. His innovative patents reflect a commitment to enhancing the performance and efficiency of integrated circuits.