Harold Moore

Title: The Innovative Mind of Harold Moore

Introduction

Harold Moore, an accomplished inventor located in Pittsford, NY, has contributed significantly to the field of electronic device packaging and plastic film processing. With five patents to his name, his innovations focus on enhancing the functionality and durability of electronic systems through advanced sealing techniques and embossing methods.

Latest Patents

Among his latest creations is a patent for "Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays." This inventive method involves depositing an electrical conductor on a substrate to establish a connection with the electronic device. It incorporates a low melting point wire of indium metal strategically placed around the device's periphery, which is then melted using ultrasonic energy and pressure to achieve a hermetic seal.

Another notable patent is the "Apparatus and method of heat embossing thin, low-density polyethylene films." This invention features both movable and stationary embossing elements that utilize controlled heating for deforming plastic web materials. The design ensures that the female dies remain at ambient temperature, enhancing precision and quality during the embossing process.

Career Highlights

Currently, Harold Moore is associated with Eastman Kodak Company, where he has been able to leverage his expertise in material processing and electronic devices. His career has been marked by continuous innovation and dedication to solving complex engineering challenges.

Collaborations

Harold's innovative journey has been supported by his collaborations with talented colleagues, including Fugui He and Douglas G. Maley. Together, they have worked on groundbreaking projects that enhance the capabilities of electronic devices and improve production techniques in the plastic industry.

Conclusion

In summary, Harold Moore exemplifies the spirit of innovation through his contributions to the fields of electronic device sealing and plastic film processing. His patents reflect a deep understanding of material science and engineering principles, making him a valuable asset to Eastman Kodak Company and the broader technological landscape. His work will undoubtedly continue to inspire future advancements in these areas.