The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2004

Filed:

May. 08, 2001
Applicant:
Inventors:

Syamal K. Ghosh, Rochester, NY (US);

Fugui He, Penfield, NY (US);

Harold Moore, Pittsford, NY (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B05D 5/12 ; B32B 3/116 ;
U.S. Cl.
CPC ...
B05D 5/12 ; B32B 3/116 ;
Abstract

A method of providing a hermetically sealed enclosure for a highly moisture sensitive electronic device including depositing an electrical conductor on the substrate which provides an electrical connection with the electronic device and depositing an electrically insulating thin layer over the electrical conductor; providing a low melting point indium metal or alloy in the form of a wire having diameter ranging from 1 mil to 10 mils on the electrically insulating thin layer on the substrate so that the wire is situated around the periphery of the electronic device; placing an ultrasonic horn over the cover plate so that ultrasonic energy can be delivered through the cover plate to the wire and applying a pressure between 20 and 100 psi; and providing an acoustic wave to melt the wire.


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