This inventor holds 1 USPTO granted patent. Top assignees: Delco Electronics Corporation, Hughes Electronics Corporation. Active years: 1999.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:

Years Active: 1999
Title: Harold M Olsen: Innovator in Sol-Gel Bonding Solutions
Introduction
Harold M Olsen is a notable inventor based in West Covina, CA (US). He is recognized for his innovative contributions to the field of bonding solutions, particularly through his patented method involving sol-gel technology. His work has implications in various industries where reliable bonding of conductive substrates is essential.
Latest Patents
Olsen holds a patent for a sol-gel bonding solution for anodic bonding. This method involves bonding two electrically conductive substrates by forming a dielectric layer from a sol-gel solution. The process includes creating an ionic depletion region in the dielectric layer through the application of a constant voltage. Following this, the substrates are heated to create an oxygen depletion region in one of the substrates. The sol-gel solution comprises sodium aluminoborosilicate with specific molar percentages of SiO.sub.2, B.sub.2 O.sub.3, Na.sub.2 O, and Al.sub.2 O.sub.3. He has 1 patent to his name.
Career Highlights
Throughout his career, Olsen has worked with prominent companies such as Hughes Electronics Corporation and Delco Electronics Corporation. His experience in these organizations has contributed to his expertise in the field of electronics and bonding technologies.
Collaborations
Olsen has collaborated with notable individuals in his field, including Ruth Ellen Beni and Larry Lee Jordan. These collaborations have likely enriched his work and contributed to advancements in bonding solutions.
Conclusion
Harold M Olsen's innovative work in sol-gel bonding solutions showcases his significant contributions to the field of electronics. His patented methods and collaborations highlight the importance of innovation in developing reliable bonding technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile