Harold K Silver

Title: Harold K. Silver: Innovator in Packaging Technology

Introduction

Harold K. Silver is a notable inventor based in Neenah, WI (US), recognized for his contributions to packaging technology. With a total of 2 patents, he has made significant advancements in the field, particularly in the development of innovative laminates and blister packages.

Latest Patents

One of Harold's latest patents is for a laminate that includes fluid compression rolled polymer. This biaxially tearable, moisture barrier laminate is comprised of a film of fluid compression rolled polymer and a film of heat seal material. The laminate is especially suited for use in the production of strip packages. Another significant patent is for a blister package of the push-through type, which comprises a thermoformed blister portion made of a laminate sealed to a foil sheet. One of the laminae, prior to thermoforming, has been fluid compression rolled from a sheet to about one third of its original thickness, affording a degree of orientation that enhances its moisture barrier properties, clarity, and strength in the thermoformed state.

Career Highlights

Harold K. Silver has built a successful career at the American Can Company, where he has applied his expertise in packaging technology. His work has contributed to the development of innovative solutions that meet the evolving needs of the packaging industry.

Collaborations

Throughout his career, Harold has collaborated with notable colleagues, including Carl C. Hein, III and Joseph J. Spitz. These collaborations have fostered an environment of innovation and creativity, leading to the successful development of new packaging solutions.

Conclusion

Harold K. Silver's contributions to packaging technology through his patents and work at the American Can Company highlight his role as an influential inventor in the industry. His innovative approaches continue to shape the future of packaging solutions.