This inventor holds 1 USPTO granted patent. Top assignee: Basf Se Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Harold Colwell: Innovator in Electronic Component Encapsulation
Introduction
Harold Colwell is a notable inventor based in Chesterfield, VA (US). He has made significant contributions to the field of electronic components through his innovative patent. His work focuses on enhancing the durability and functionality of electronic assemblies.
Latest Patents
Colwell holds a patent for a "Method of encapsulating an electronic component." This invention involves an encapsulated electronic assembly that comprises an electronic component and a foamed thermoplastic shell. The shell is formed from a thermoplastic encapsulant that includes a thermoplastic resin and a filler, which is foamed with a foaming agent. The method includes melting the thermoplastic encapsulant, foaming it, and injection molding the foamed thermoplastic encapsulant around the electronic component to create the protective shell.
Career Highlights
Colwell is associated with BASF SE Corporation, where he applies his expertise in materials science and engineering. His innovative approach to encapsulating electronic components has the potential to improve the reliability of various electronic devices.
Collaborations
Colwell has worked alongside talented colleagues such as Richard J. Lair and David M. Lange. Their collaborative efforts contribute to the advancement of technology in the field of electronics.
Conclusion
Harold Colwell's contributions to the encapsulation of electronic components demonstrate his commitment to innovation and excellence in engineering. His patent reflects a significant advancement in the protection of electronic assemblies, showcasing his role as a key inventor in this field.