Company Filing History:
Years Active: 2022
Title: The Innovative Genius of Harold A. Haldren
Introduction: Harold A. Haldren, a remarkable inventor based in Silver Spring, MD, has made significant contributions to the field of adhesive bond strength evaluation. His inventive spirit and dedication have led him to develop a unique method that utilizes ultrasonic testing to assess adhesion properties in various materials.
Latest Patents: Haldren holds a patent for his invention titled "Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements." This innovative method provides a systematic approach to ultrasonic testing of adhesion by delivering bursts of different frequencies to a sample. By maintaining a predetermined phase difference between the echoes returned from the sample and the representative reference signals, this technique allows for the derivation of adhesion properties at an interface based on the spectrum of phase differences obtained.
Career Highlights: Haldren's career is marked by his association with NASA, where he works as part of a team that strives to push the boundaries of technology and innovation. His dedication to research and development is evident in his commitment to enhancing bonding techniques that can benefit various industries, including aerospace and manufacturing.
Collaborations: Throughout his career, Harold A. Haldren has collaborated with notable colleagues such as Daniel F. Perey and William T. Yost. Together, these professionals have shared their expertise and insights to advance the field of adhesive technology, striving for precision and efficiency in their innovative endeavors.
Conclusion: Harold A. Haldren's contributions to the world of adhesives through his patented method exemplify the remarkable impact that dedicated inventors can have on technology. His work not only enhances our understanding of adhesion but also sets the stage for future advancements in industrial applications.