Hariprasad Amanapu

Title: Hariprasad Amanapu: Innovator in Abrasive-Free Planarization Technology

Introduction

Hariprasad Amanapu is a notable inventor based in Heverlee, Belgium. He has made significant contributions to the field of semiconductor manufacturing, particularly in the area of mask substrate technology. His innovative approach has led to advancements that enhance the precision and efficiency of the manufacturing process.

Latest Patents

Amanapu holds a patent for "Abrasive-free planarization for EUV mask substrates." This patent describes a process for abrasive-free chemical mechanical planarization of silicon thin film coated EUV mask substrates. The process effectively removes bumps and pits on the substrate, thereby mitigating reflective errors in the mask. It employs a two-step polishing procedure, where the second step is abrasive-free and utilizes an amine or amine salt as the polishing agent. This innovation is crucial for improving the quality of EUV masks used in advanced lithography.

Career Highlights

Throughout his career, Hariprasad Amanapu has worked with prominent organizations such as Sematech, Inc. and Clarkson University. His experience in these institutions has allowed him to develop and refine his expertise in semiconductor technologies and materials science. His work has been instrumental in pushing the boundaries of what is possible in the field.

Collaborations

Amanapu has collaborated with several talented individuals, including Suryadevara Vijayakumar Babu and Uma Rames Krishna Laguda. These collaborations have fostered a creative environment that has led to innovative solutions in the industry.

Conclusion

Hariprasad Amanapu's contributions to abrasive-free planarization technology represent a significant advancement in semiconductor manufacturing. His innovative patent and collaborative efforts highlight his commitment to improving the efficiency and accuracy of EUV mask substrates. His work continues to influence the field and pave the way for future innovations.