Hyderabad Telangana, India

Hariharan Subramanian


Average Co-Inventor Count = 12.0

ph-index = 1


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: **Inventor Profile: Hariharan Subramanian**

Introduction

Hariharan Subramanian is a noteworthy inventor based in Hyderabad, Telangana, India. With a keen focus on technological advancements, he has made significant contributions to the field of transport protocols, earning him a patent for his innovative work.

Latest Patents

Hariharan is credited with one patent titled “Methods and apparatus for transport protocol ACK aggregation.” This invention encompasses methods, apparatuses, and computer-readable media for improving data transmission reliability. The process involves receiving at least one transport protocol (TP) packet, computing current data rates, determining low throughput phases, and efficiently aggregating received TP packets or acknowledgments (ACK) to enhance communication effectiveness during data transmission.

Career Highlights

Hariharan currently works at Qualcomm Incorporated, a global leader in semiconductor and telecommunications equipment. His role at Qualcomm emphasizes his expertise in network technology and innovation, where he continuously contributes to enhancing data communication systems.

Collaborations

Throughout his career, Hariharan has collaborated with talented professionals in his field, including Prachi Agrawal and Arnaud Meylan. These collaborations reflect his commitment to working alongside other innovators to push the boundaries of technology and enhance overall functionality in their projects.

Conclusion

In summary, Hariharan Subramanian stands out as a prolific inventor in the realm of transport protocols. His patent for ACK aggregation underscores his commitment to innovation and improvement in communication systems. With a strong foundation in his field and effective collaborations, Hariharan continues to impact the technology landscape through his work at Qualcomm Incorporated.

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