This inventor holds 2 USPTO granted patents. Top assignees: Ford Global Technolgoies, LLC, Ford Motor Company Limited. Active years: 2003-2004.
Company Filing History:


Years Active: 2003-2004
Title: Innovations by Harihar T Kulkarni
Introduction
Harihar T Kulkarni is an accomplished inventor based in Canton, MI (US). He holds 2 patents that showcase his expertise in automotive technology and adhesive bonding methods. His innovative contributions have significantly impacted the design and simulation of automotive structures.
Latest Patents
Kulkarni's latest patents include a "System and method for designing automotive structure using adhesives." This invention involves a CAE system that receives programmable parameters or user input data to generate a computer model of a body structure. The model is analyzed and optimized to minimize the weight of the body structure through adhesive bond technology. Another notable patent is the "Method for simulating a joint," which provides a more accurate simulation of an adhesive joint with a changing elasticity modulus over time and temperature. This method collects stress and strain values to determine the elastic modulus, allowing for the formation of a simulated joint capable of producing strain values based on stress data.
Career Highlights
Throughout his career, Kulkarni has worked with prominent companies such as Ford Global Technologies, LLC and Ford Motor Company Limited. His experience in these organizations has allowed him to develop and refine his innovative ideas in the automotive sector.
Collaborations
Kulkarni has collaborated with notable coworkers, including Subhash C Jasuja and Paul E Geck. Their teamwork has contributed to the advancement of automotive technologies and adhesive applications.
Conclusion
Harihar T Kulkarni's contributions to automotive innovation through his patents and collaborations highlight his significant role in the industry. His work continues to influence the design and simulation of automotive structures, showcasing the importance of adhesive technology in modern engineering.