Hao-Wei Tseng

Title: Hao-Wei Tseng: Innovator in Package Structure Technology

Introduction

Hao-Wei Tseng is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of package structure technology, particularly in the design and manufacturing methods of electronic components. His innovative approach has led to the development of a unique patent that enhances the functionality and efficiency of light-emitting diodes.

Latest Patents

Hao-Wei Tseng holds a patent for a "Package structure and manufacturing method of the same." This patent describes a package structure that includes a substrate, multiple conductive pads, a light-emitting diode, a photo imageable dielectric material, and a black matrix. The design ensures that the orthogonal projection of the light-emitting diode overlaps with that of the photo imageable dielectric material on the substrate, optimizing the performance of the electronic component. He has 1 patent to his name.

Career Highlights

Hao-Wei Tseng is currently employed at Unimicron Technology Corporation, where he continues to innovate and develop advanced packaging solutions for electronic devices. His work has been instrumental in improving the efficiency and reliability of electronic components used in various applications.

Collaborations

Throughout his career, Hao-Wei Tseng has collaborated with talented individuals such as Chi-Hai Kuo and Jeng-Ting Li. These collaborations have fostered a creative environment that encourages the exchange of ideas and the development of cutting-edge technologies.

Conclusion

Hao-Wei Tseng is a prominent figure in the field of package structure technology, with a focus on enhancing electronic components. His innovative patent and contributions to Unimicron Technology Corporation highlight his commitment to advancing technology in this area.