Keelung, Taiwan

Hao-Chieh Tseng

This inventor holds 1 USPTO granted patent. Top assignee: Dell Products Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hao-Chieh Tseng. Retrieved from https://idiyas.com/inventor/hao-chieh-tseng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hao-Chieh Tseng and a Lift-Up Foot Mechanism for Hideaway Cooling Fins.

Introduction

Hao-Chieh Tseng is an inventor associated with Keelung, Taiwan. His patent work includes a mechanism designed to coordinate a device’s support foot with its cooling system.

Latest Patents

Tseng is credited with 1 patent: “Lift-up foot mechanism for hideaway cooling fins.” The invention describes an information handling system with a top portion, heatsink, base, and foot. When the top is closed, the foot retracts around the heatsink’s extension. When the top opens, the foot extends, making the heatsink extension visible. This arrangement links the device’s opening and support mechanisms with the placement of its cooling fins.

Career Highlights

Tseng’s listed patent is associated with Dell Products Inc. The available information identifies his work in the design of an integrated foot and heatsink mechanism for an information handling system.

Collaborations

The patent connects Tseng’s invention with Dell Products Inc. No additional collaborators are identified in the provided information.

Conclusion

Hao-Chieh Tseng’s patent presents a coordinated design in which a device’s foot changes position as its top opens or closes, revealing or concealing an extension of the heatsink.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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