Company Filing History:
Years Active: 2000-2003
Title: The Innovations of Hans-Peter Fuessl
Introduction
Hans-Peter Fuessl is a notable inventor based in Reutlingen, Germany. He has made significant contributions to the field of electroconductive adhesives and chip stacking methods. With a total of 2 patents to his name, Fuessl's work is recognized for its innovative approach to enhancing electronic component manufacturing.
Latest Patents
Fuessl's latest patents include a luminescent electroconductive adhesive and a method of stacking chips with a removable connecting layer. The luminescent electroconductive adhesive incorporates a luminescent heterocyclic compound, particularly a benzoxazol, into a silver-charged epoxy-resin adhesive. This adhesive is designed for bonding electrical components to circuit carriers, especially in automated process control environments. The second patent details a method for manufacturing chip stacks, where wafers are stacked with an adhesive foil that remains intact during the cutting process. This innovative method allows for efficient stacking of chips, enhancing the manufacturing process.
Career Highlights
Fuessl is currently employed at Robert Bosch GmbH, a leading company in the engineering and technology sector. His work at Bosch has allowed him to develop and refine his inventions, contributing to advancements in electronic manufacturing.
Collaborations
Fuessl has collaborated with notable coworkers such as Werner Herden and Johann Konrad. Their combined expertise has fostered an environment of innovation and creativity within their projects.
Conclusion
Hans-Peter Fuessl's contributions to the field of electroconductive adhesives and chip stacking methods highlight his role as a significant inventor. His patents reflect a commitment to advancing technology in electronic manufacturing.