Robert Boschgmbh

Hans-Peter Fuessl

Werner Herden

Ning Qu

Johann Konrad

Rainer Widmann

Volker Brielmann

Massimo Anghileri

Alexander Volz

Helmut Duscha

Martin Knapp

Hans-Peter Jahn

Peter Keller-Sornig

Michalis Stefanopulos

Peter Schwaller

Wilhelm Eckert

An electroconductive adhesive to which a luminescent heterocyclic compound, especially a benzoxazol, is added. The ratio of the heterocyclic compound in the adhesive, which preferably is a silver-charged, epoxy-resin adhesive, is 0.01% to 0.5% by weight. The adhesive is especially suitable for bonding electrical components to circuit carriers where automated process control is employed.

Luminescent electroconductive adhesive

A method for manufacturing chip stacks in which wafers are stacked one on top of the other. The wafer is provided with an adhesive foil on its bottom, and is subsequently cut into chips so that the adhesive foil remains intact and the chips adhering to the adhesive foil are stacked one on top of the other. A first layer of chips is reversibly attached to a baseplate, the adhesive foil is removed, the next layer of chips is attached to the bottom side of the chips already fastened to the baseplate, the adhesive foil is removed, and the last two steps are repeated until the desired number of chips is stacked one on top of the other.

Method of stacking chips with a removable connecting layer

Growing community of inventors

Reutlingen, Germany

Hans-Peter Fuessl