Munich, Germany

Hans-Joachim Dingler

This inventor holds 1 USPTO granted patent and 1 EPO patent. Top assignee: Buhl-Paperform Gmbh. Active years: 2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hans-Joachim Dingler. Retrieved from https://idiyas.com/inventor/hans-joachim-dingler

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

 

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2017

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1 patent (USPTO):Explore Patents

Title: The Innovative Mind of Hans-Joachim Dingler

Introduction

Hans-Joachim Dingler is a notable inventor based in Munich, Germany. He is recognized for his contributions to the field of packaging technology. His innovative approach has led to the development of a unique patent that addresses the challenges of product protection during transportation.

Latest Patents

Hans-Joachim Dingler holds a patent for a shock-absorbing packaging insert. This invention is designed to enhance the safety and integrity of products during shipping, minimizing damage from impacts. His patent is a testament to his commitment to improving packaging solutions.

Career Highlights

Throughout his career, Dingler has worked with several prominent companies. He has been associated with Buhl-Paperform GmbH, where he contributed to advancements in packaging technology. Additionally, he has worked with Siegenia-Aubi KG, further expanding his expertise in the field.

Collaborations

One of his notable collaborators is Christoph Buhl. Their partnership has fostered innovative ideas and solutions in the packaging industry.

Conclusion

Hans-Joachim Dingler's work exemplifies the spirit of innovation in packaging technology. His contributions, particularly his patent for a shock-absorbing packaging insert, highlight his dedication to enhancing product safety. His career reflects a commitment to excellence and collaboration in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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