Gernsheim, Germany

Hans Hackner

This inventor holds 1 USPTO granted patent. Top assignee: Basf Aktiengesellschaft. Active years: 1976.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hans Hackner. Retrieved from https://idiyas.com/inventor/hans-hackner

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1976

Loading Chart...
1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Hans Hackner

Introduction

Hans Hackner is a notable inventor based in Gernsheim, Germany. He has made significant contributions to the field of packaging technology. His innovative approach has led to the development of a unique process and apparatus for filling foldable or rigid packages.

Latest Patents

Hans Hackner holds 1 patent for his invention titled "Process and apparatus for filling foldable or rigid packages." This invention involves a method for filling packages with free-flowing solids through spouts. The process includes initially feeding some material to the package while it is in its gravity position. The position of the package is then changed multiple times with shaking, allowing for efficient filling before the remainder of the material is added.

Career Highlights

Hans Hackner is associated with BASF Aktiengesellschaft, a leading chemical company known for its innovative solutions. His work at BASF has allowed him to explore and develop advanced packaging technologies that enhance efficiency and effectiveness in the industry.

Collaborations

Throughout his career, Hans has collaborated with esteemed colleagues such as Wolfgang Guenther and Gunter Thielen. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Hans Hackner's contributions to packaging technology exemplify the spirit of innovation. His patent for filling packages demonstrates his commitment to improving industrial processes. His work continues to influence the field and inspire future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…