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Hans Erik Ekstroem

This inventor holds 0 USPTO granted patents, plus 1 CIPO patent.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hans Erik Ekstroem. Retrieved from https://idiyas.com/inventor/hans-erik-ekstroem

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Title: Hans Erik Ekstroem: Innovator in Sandwich Materials for Brazing

Introduction

Hans Erik Ekstroem is a notable inventor based in Sweden, recognized for his contributions to the field of materials science. His innovative work focuses on developing advanced sandwich materials for brazing applications, which are essential in various industrial processes.

Latest Patents

Hans Erik Ekstroem holds a patent for a unique sandwich material designed for brazing, characterized by its high strength at elevated temperatures. The invention involves a core layer made from a specific aluminum alloy, which includes a precise composition of elements such as manganese, magnesium, silicon, titanium, chromium, zirconium, copper, zinc, indium, tin, and iron. The barrier layer is also composed of a carefully formulated aluminum alloy, ensuring optimal performance in high and low-temperature applications. Despite having 0 patents, his work significantly impacts the industry.

Career Highlights

Ekstroem is associated with Sapa Heat Transfer AB, a company known for its expertise in heat transfer solutions. His role at the company allows him to apply his innovative ideas in practical applications, contributing to advancements in brazing technology.

Collaborations

Due to space constraints, the collaborations section will be omitted.

Conclusion

Hans Erik Ekstroem's work in developing sandwich materials for brazing showcases his innovative spirit and dedication to advancing materials science. His contributions, particularly through his association with Sapa Heat Transfer AB, highlight the importance of innovation in industrial applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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