Hanmin Lee

Title: Hanmin Lee - Innovator in Semiconductor Technology

Introduction

Hanmin Lee is a talented inventor based in Suwon-si, South Korea. She has made significant contributions to the field of semiconductor technology. Although she currently holds no granted patents, her innovative ideas are reflected in her latest patent applications.

Latest Patent Applications

One of her notable applications is for a SEMICONDUCTOR STACK PACKAGE. This invention relates to a semiconductor stack package that includes a semiconductor stack structure comprising multiple semiconductor packages with fan-out wiring. The design features a base substrate with an inclined surface that supports the semiconductor packages, along with a rewiring structure that connects to the fan-out wiring. The arrangement allows for efficient stacking of the semiconductor packages on the inclined surface, ensuring that the inclined cut surface of each package is flush with the upper surface of the stack structure.

Another significant application is for a SEMICONDUCTOR DEVICE. This device includes a first semiconductor chip with a first through silicon via (TSV) and a second semiconductor chip arranged on top of it. The second chip features a second TSV aligned vertically with the first. Each TSV has a conductive pad that electrically connects the two chips. Additionally, a warpage prevention metal structure is placed on the upper surface of either the first or second semiconductor chip to enhance stability.

Conclusion

Hanmin Lee's innovative work in semiconductor technology showcases her potential as an inventor. Her latest patent applications reflect her commitment to advancing the field, and her contributions may lead to significant developments in semiconductor devices.