This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Han Sung Ryu and Semiconductor Packaging Innovation.
Introduction
Han Sung Ryu is an inventor based in Suwon, South Korea, associated with Samsung Electronics Co., Ltd. His patent work concerns semiconductor packaging, an area focused on connecting and supporting semiconductor chips within electronic devices.
Latest Patents
Ryu is named on 1 patent, titled “Semiconductor package.” The invention describes a package with a first substrate, solder balls on its lower surface, and a semiconductor chip on its upper surface. It specifies the positions and spacing of solder balls around the substrate’s center, including a narrower pitch between a ball and its outer adjacent ball than between that ball and its inner adjacent ball.
Career Highlights
Ryu’s listed patent reflects work on the arrangement of solder balls in semiconductor packages. Such layout details are relevant to the package’s electrical connections and physical design.
Collaborations
Ryu’s listed coworkers include Ji Hyun Lee and Jun Ho Lee. The available information identifies them as colleagues but does not specify their roles in the patent.
Conclusion
Han Sung Ryu’s patent record highlights his contribution to semiconductor package design through a detailed arrangement of substrate-mounted solder balls.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile