Company Filing History:
Years Active: 2017-2024
Title: Hamdan Ismail: Innovator in Microelectronic Packaging
Introduction
Hamdan Ismail is a notable inventor based in Seremban, Malaysia. He has made significant contributions to the field of microelectronics, particularly in the development of innovative packaging solutions. With a total of 3 patents to his name, Ismail continues to push the boundaries of technology.
Latest Patents
One of Hamdan Ismail's latest patents focuses on overmolded microelectronic packages containing knurled flanges. This invention provides methods for producing these advanced packages, which include a molded package body and at least one microelectronic device. The base flange of the package is designed with a knurled surface region that features a series of trenches arranged in a geometric pattern. This design enhances the bond between the molded package body and the base flange, reducing the likelihood of delamination.
Career Highlights
Hamdan Ismail is currently employed at NXP USA, Inc., where he applies his expertise in microelectronic packaging. His work has been instrumental in advancing the technology used in electronic devices, making them more reliable and efficient. Ismail's innovative approach has garnered attention in the industry, positioning him as a key player in the field.
Collaborations
Throughout his career, Hamdan has collaborated with talented individuals such as Audel Sanchez and Jerry Lynn White. These partnerships have allowed him to enhance his work and contribute to various projects within the microelectronics sector.
Conclusion
Hamdan Ismail is a distinguished inventor whose work in microelectronic packaging has made a significant impact on the industry. His innovative patents and collaborations reflect his commitment to advancing technology. As he continues to develop new solutions, Ismail's contributions will undoubtedly shape the future of microelectronics.