This inventor holds 1 USPTO granted patent. Top assignee: Granmont, Inc.. Active years: 1994.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1994
Title: Hak H Wu: Innovator in Composite Printed Circuit Board Technology
Introduction
Hak H Wu is a notable inventor based in Tucson, AZ (US). He has made significant contributions to the field of printed circuit board technology. His innovative work focuses on composite printed circuit board substrates, which are essential in modern electronics.
Latest Patents
Hak H Wu holds a patent for a "Composite printed circuit board substrate and process for its manufacture." This invention involves composite printed circuit board substrates that feature fiber reinforcement within a polymer matrix. The fibers utilized in this technology may include thermotropic melt processable liquid crystal polymer fibers. This advancement enhances the performance and durability of printed circuit boards.
Career Highlights
Hak H Wu is associated with Granmont, Inc., where he applies his expertise in developing cutting-edge technologies. His work has contributed to the advancement of materials used in electronic devices, making them more efficient and reliable.
Collaborations
Throughout his career, Hak H Wu has collaborated with talented individuals such as Vincent M Vancho and Yutao Ma. These partnerships have fostered innovation and have led to the development of groundbreaking technologies in the field.
Conclusion
Hak H Wu's contributions to the field of composite printed circuit board technology exemplify his dedication to innovation. His patent and work at Granmont, Inc. highlight his role as a key player in advancing electronic materials.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile