Haiying Li

Title: Innovations of Inventor Haiying Li

Introduction

Haiying Li is a prominent inventor based in Atlanta, GA, known for his contributions to the field of electronic packaging. He has been instrumental in developing advanced materials that enhance the performance and reliability of electronic systems. With a total of 2 patents, his work focuses on innovative epoxy underfills for flip-chip applications.

Latest Patents

Haiying Li's latest patents include the development of a no-flow reworkable epoxy underfill and a thermally degradable epoxy underfill. The no-flow reworkable epoxy underfill is designed for use in electronic packaged systems that incorporate integrated circuits and organic printed wire boards. This encapsulant features a cycloaliphatic epoxide, an organic hardener, a curing accelerator, and a fluxing agent, with the potential inclusion of silica fillers. Similarly, the thermally degradable epoxy underfill also utilizes a cycloaliphatic epoxide and is aimed at improving the reworkability of electronic packages.

Career Highlights

Haiying Li is affiliated with the Georgia Tech Research Corporation, where he continues to push the boundaries of material science in electronics. His innovative approaches have garnered attention in the industry, contributing to advancements in electronic packaging technologies.

Collaborations

Some of his notable coworkers include Lejun Wang and Ching-Ping Wong, who collaborate with him on various research projects aimed at enhancing electronic materials.

Conclusion

Haiying Li's work exemplifies the spirit of innovation in the field of electronic packaging. His patents reflect a commitment to improving the reliability and performance of electronic systems, making significant contributions to the industry.