White Plains, NY, United States of America

Haitian Hu

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2012-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haitian Hu. Retrieved from https://idiyas.com/inventor/haitian-hu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 2.7

ph-index = 1

Forward Citations = 10(Granted Patents)


Location History:

  • Hopewell Jct., NY (US) (2012)
  • White Plains, NY (US) (2014)

Company Filing History:


Years Active: 2012-2014

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2 patents (USPTO):Explore Patents

Title: Innovations by Inventor Haitian Hu: A Glimpse into His Patent Contributions

Introduction

Haitian Hu, a prominent inventor based in White Plains, NY, has made significant strides in the field of electronics through his innovative contributions. With a total of two patents to his name, Hu's work primarily focuses on improving interconnect technology within integrated circuits, showcasing his expertise and creativity in addressing complex engineering challenges.

Latest Patents

Haitian Hu's latest patents reflect his commitment to advancing technology in the realm of clock signal routing and bond wire interconnects. His first patent, titled "Routing of Local Clock Interconnects," introduces an improved method for managing the routing of clock signals. In this innovation, Hu proposes a technique where an endpoint's pin representation helps calculate the original delay in a route segment supplying the clock signal. If this delay surpasses a specific threshold, a cross-link is incorporated to form a non-tree sub-network, which efficiently reduces clock skew at the pin by modifying the segment based on a revised delay calculation.

His second patent, "Multi-segments Modeling Bond Wire Interconnects with 2D Simulations in High-Speed, High-Density Wire Bond Packages," provides a sophisticated approach to modeling bond wires in integrated circuit packages. This method addresses noise effects caused by electromagnetic coupling in intricate bond wire configurations. By employing a look-up table of equivalent LC circuit models for bond wires, Hu's invention significantly simplifies the modeling process and improves the accuracy of predictions related to signal transmission systems.

Career Highlights

As an inventor working with International Business Machines Corporation (IBM), Haitian Hu has been at the forefront of innovations in electronic circuit design. His focus on optimizing clock signal routing and modeling bond wire interconnects demonstrates his pivotal role in enhancing electronic devices' performance and reliability. Hu's patents are indicative of his dedication to driving technological advancements that impact the field of electronics.

Collaborations

Haitian Hu has collaborated closely with esteemed colleagues Timothy W. Budell and Charles S. Chiu at IBM. Together, they contribute to a dynamic research environment that fosters innovation and supports the development of groundbreaking technologies. This collaborative spirit exemplifies the collective effort to solve complex engineering problems in the semiconductor industry.

Conclusion

With a keen eye for detail and a passion for innovation, Haitian Hu continues to influence the world of electronics through his patents and collaborative efforts. His contributions not only enhance current technology but also pave the way for future developments in the industry. As technology evolves, Hu's innovations are set to leave a lasting impact on the way integrated circuits and electronic devices function.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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