Haisheng Wang

Title: Haisheng Wang: Innovator in Circuit Packaging Technology

Introduction

Haisheng Wang is a notable inventor based in Shandong, China. He has made significant contributions to the field of microelectronics, particularly in the packaging methods for circuit units. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of circuit unit packaging.

Latest Patents

Wang holds a patent for a "Packaging method for circuit units comprising circuit baseplate." This patent discloses a method that involves attaching multiple circuit units to a circuit baseplate in a spaced and inverted manner. The process includes using a silicon layer substrate and a silicon dioxide layer, which are crucial for the functionality of the circuit units. The method also details the formation of an insulator between the circuit units and the creation of an electromagnetic shielding layer, which is essential for protecting the circuit components.

Career Highlights

Haisheng Wang is currently employed at Weifang Goertek Microelectronics Co., Ltd. His work at this company has allowed him to focus on advancing microelectronic technologies. Wang's innovative contributions have positioned him as a key figure in the development of new packaging methods that improve circuit unit performance.

Collaborations

Wang collaborates with talented colleagues such as Dewen Tian and Qinglin Song. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Haisheng Wang's contributions to circuit packaging technology exemplify the impact of innovative thinking in the field of microelectronics. His patent and collaborative efforts continue to influence advancements in this critical area of technology.