Changchun, China

Hairui Du

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Jilin University. Active years: 2023.

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 7.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Innovations of Hairui Du in Metal Additive Manufacturing

Introduction

Hairui Du is a prominent inventor based in Changchun, China. He has made significant contributions to the field of metal additive manufacturing. His innovative work focuses on enhancing mechanical properties through advanced extrusion mechanisms.

Latest Patents

Hairui Du holds a patent for a "Metal additive manufacturing extrusion mechanism for monitoring and improving mechanical properties in situ." This invention relates to a mechanism that comprises a wire conveying unit, a composite cavity unit, a high-temperature loading unit, a temperature detecting unit, a pressure loading unit, a pressure detecting unit, and an in-situ monitoring unit. The mechanism achieves multi-stage high-temperature loading through silicon nitride heater components and ensures service temperature detection via thermocouple components. Additionally, it incorporates multi-stage pressurization through continuous pressure loading and high-frequency pressure loading, with service pressure detection facilitated by strain gauge components.

Career Highlights

Hairui Du is affiliated with Jilin University, where he continues to advance research in metal additive manufacturing. His work is pivotal in developing technologies that improve the mechanical properties of materials used in various applications.

Collaborations

He collaborates with notable colleagues, including Zhichao Ma and Shuai Tong, contributing to a dynamic research environment focused on innovation and technological advancement.

Conclusion

Hairui Du's contributions to metal additive manufacturing exemplify the importance of innovation in engineering. His patented mechanisms are set to influence the future of manufacturing processes significantly.

Profile summary based on public USPTO records.
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