Haim Snapy

Title: Haim Snapy: Innovator in Wireless Communication

Introduction

Haim Snapy is a prominent inventor based in San Diego, California. He has made significant contributions to the field of wireless communication, holding a total of four patents. His work focuses on enhancing the efficiency and effectiveness of modem technologies.

Latest Patents

One of Haim Snapy's latest patents is titled "Uplink segmentation offload to modem." This invention provides a method, apparatus, and computer-readable medium for wireless communication at a modem. It involves receiving an internet protocol (IP) packet that exceeds the maximum transport unit (MTU) size. The modem segments this IP packet into multiple segments based on a specified segmentation policy. Each segment includes derived headers and checksums, ensuring accurate transmission over the communication link.

Another notable patent is related to "Transmission control protocol (TCP) and/or user datagram protocol (UDP) receive offloading." This invention allows a device to receive multiple data packets at its modem. The device groups payloads from a subset of these packets into a container and transfers them to a processor via different interface channels. This innovation enhances the overall data handling capabilities of the device.

Career Highlights

Haim Snapy has established himself as a key figure in the wireless communication sector. His work at Qualcomm Incorporated has positioned him at the forefront of technological advancements in modem functionality. His patents reflect a deep understanding of communication protocols and their practical applications.

Collaborations

Haim Snapy has collaborated with notable colleagues, including Alok Mitra and Vaibhav Kumar. These partnerships have contributed to the development of innovative solutions in the field of wireless communication.

Conclusion

Haim Snapy's contributions to wireless communication through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of modem technology and communication protocols.