Azur, Israel

Haim Epstein

This inventor holds 1 USPTO granted patent. Top assignee: Powerdsine Ltd. - Microsemi Corporation. Active years: 2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haim Epstein. Retrieved from https://idiyas.com/inventor/haim-epstein

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 71(Granted Patents)


Company Filing History:


Years Active: 2007

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1 patent (USPTO):Explore Patents

Title: Haim Epstein - Innovator in Telecommunications

Introduction

Haim Epstein is a notable inventor based in Azur, Israel. He has made significant contributions to the field of telecommunications, particularly with his innovative designs that enhance device functionality and efficiency.

Latest Patents

Haim Epstein holds a patent for a "High Density Front Access Device." This invention features a chassis frame designed for mounting in standardized telecommunications racks. The device includes a sub-module chassis with a first plurality of jacks and a passageway for cabling, facilitating efficient connections.

Career Highlights

Haim Epstein is associated with Powerdsine Ltd., a subsidiary of Microsemi Corporation. His work at this company has allowed him to focus on developing advanced telecommunications solutions that meet the growing demands of the industry.

Collaborations

One of Haim Epstein's notable coworkers is David Pincu. Their collaboration has contributed to the innovative projects at Powerdsine Ltd., enhancing the company's reputation in the telecommunications sector.

Conclusion

Haim Epstein's contributions to telecommunications through his patent and work at Powerdsine Ltd. highlight his role as an influential inventor in the industry. His innovative designs continue to shape the future of telecommunications technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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