Shanghai, China

Hailin Cheng


Average Co-Inventor Count = 3.1

ph-index = 1


Company Filing History:


Years Active: 2021

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2 patents (USPTO):

Title: Hailin Cheng: Innovator in Optical Path Compensation and Chip Bonding Technologies

Introduction

Hailin Cheng is a prominent inventor based in Shanghai, China. He has made significant contributions to the fields of optical path compensation and chip bonding technologies. With a total of two patents to his name, Cheng's work showcases his innovative spirit and technical expertise.

Latest Patents

Cheng's latest patents include an optical path compensation device and a chip bonding device. The optical path compensation apparatus features a wedge assembly, a driving mechanism, and a preload unit. This design allows for effective position correction of a focal plane in measurement systems, ensuring smooth and precise adjustments without introducing errors in other directions. The chip bonding apparatus consists of a chip separation unit, a chip alignment unit, a chip bonding unit, and a bonding robotic arm unit. This sophisticated system enhances the efficiency of chip handling and bonding processes.

Career Highlights

Hailin Cheng is associated with Shanghai Micro Electronics Equipment (Group) Co., Ltd., where he applies his expertise in developing cutting-edge technologies. His work has been instrumental in advancing the capabilities of microelectronics equipment.

Collaborations

Cheng collaborates with talented individuals such as Shurong Li and Feibiao Chen, contributing to a dynamic team focused on innovation and excellence in their field.

Conclusion

Hailin Cheng's contributions to optical path compensation and chip bonding technologies highlight his role as a key innovator in the microelectronics industry. His patents reflect a commitment to enhancing precision and efficiency in technological applications.

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