Dongguan, China

Hailang Wang

This inventor holds 1 USPTO granted patent. Top assignee: Dongguan Songde Hardware Electronics Co. Ltd. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hailang Wang. Retrieved from https://idiyas.com/inventor/hailang-wang-qgm3y8d3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Hailang Wang: Innovator in Water-Cooling Technology

Introduction

Hailang Wang is a notable inventor based in Dongguan, China. He has made significant contributions to the field of water-cooling technology, particularly with his innovative designs that enhance efficiency and performance.

Latest Patents

Hailang Wang holds a patent for an integral water-cooling radiator. This invention features a water cooling block with a fixed base that includes first and second through flow chambers. A rotatable impeller is positioned in the first chamber, which communicates with a drive chamber. The design incorporates an impeller region and temporary storage regions that facilitate improved heat transfer while minimizing cavitation and erosion.

Career Highlights

Wang is currently employed at Dongguan Songde Hardware Electronics Co. Ltd. His work focuses on developing advanced cooling solutions that are essential for various electronic applications. His innovative approach has led to the creation of a product that not only enhances cooling efficiency but also addresses common issues faced in traditional designs.

Collaborations

Hailang Wang collaborates with talented coworkers, including Cheng Zhang and Hong Yang. Their combined expertise contributes to the development of cutting-edge technologies in the hardware electronics sector.

Conclusion

Hailang Wang's contributions to water-cooling technology exemplify the spirit of innovation. His patent for the integral water-cooling radiator showcases his commitment to improving efficiency in electronic cooling solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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