Shenzhen, China

HaiJun Zhang

This inventor holds 6 USPTO granted patents and 3 published patent applications and 1 EPO patent. Top assignees: Astec International Limited, Harbin Institute of Technology, Shenzhen Sunway Communication Co., Ltd.. Active years: 2013-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: HaiJun Zhang. Retrieved from https://idiyas.com/inventor/haijun-zhang-ay005v7y

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 6 

% Patents Active = 66.7

 

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2013-2026

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6 patents (USPTO):Explore Patents

Title: The Innovative Journey of HaiJun Zhang

Introduction: HaiJun Zhang, a pioneering inventor hailing from Shenzhen, China, has made significant contributions to the world of technology through his groundbreaking innovations and patents.

Latest Patents: Zhang's latest patents showcase his expertise in the field of artificial intelligence and robotics, with a focus on developing cutting-edge solutions for various industries.

Career Highlights: With a career spanning over two decades, HaiJun Zhang has established himself as a leading figure in the tech industry, holding numerous patents that have revolutionized the way we interact with technology on a daily basis.

Collaborations: Throughout his career, Zhang has collaborated with top research institutions and tech companies to bring his inventions to life, solidifying his reputation as a visionary inventor with a keen eye for future trends.

Conclusion: HaiJun Zhang's relentless pursuit of innovation and his passion for pushing the boundaries of technology have cemented his legacy as a trailblazing inventor in the ever-evolving tech landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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