Tianjin, China

Haihui Li

This inventor holds 1 USPTO granted patent. Top assignee: Vanchip (Tianjin) Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Haihui Li. Retrieved from https://idiyas.com/inventor/haihui-li-z0mhsdo3

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Haihui Li in Radio Frequency Technology

Introduction

Haihui Li is a prominent inventor based in Tianjin, China. He has made significant contributions to the field of radio frequency technology. His innovative work focuses on enhancing the performance and efficiency of communication systems.

Latest Patents

Haihui Li holds a patent for a "Radio frequency power amplifier that reduces load change sensitivity." This invention includes a feedback circuit and multiple levels of amplification circuits. The design connects the feedback circuit and amplification circuits in parallel between two nodes, creating a feedback loop that achieves a specific phase shift. This technology aims to improve the reliability and performance of communication terminals.

Career Highlights

Haihui Li is associated with Vanchip (Tianjin) Technology Co., Ltd., where he continues to develop cutting-edge solutions in radio frequency applications. His expertise in this area has positioned him as a valuable asset to his company and the industry.

Collaborations

Haihui Li collaborates with his coworker, Yunfang Bai, to further advance their research and development efforts. Their teamwork enhances the innovation process and contributes to the success of their projects.

Conclusion

Haihui Li's contributions to radio frequency technology exemplify the impact of innovative thinking in communication systems. His patent reflects a commitment to improving technology for better performance and reliability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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