Company Filing History:
2 out of 832,680 Years Active: 2021-2023
Title: Haidong Yang: Innovator in Heat Resistant Polyimide Film
Introduction
Haidong Yang is a notable inventor based in Harbin, China. He has made significant contributions to the field of materials science, particularly in the development of high temperature resistant polyimide films. With a total of 2 patents to his name, Yang's work addresses critical challenges in adhesive materials used in various applications.
Latest Patents
Haidong Yang's latest patents focus on a high temperature resistant polyimide film and its preparation method. The invention aims to solve issues related to the insufficient heat resistance of honeycomb and skin panel core adhesive-polyimide films. The innovative process involves creating a polyimide film using a polyimide solution, inorganic filler modifier, and interface coupling agent. Under specific temperature and stirring conditions, these components are combined to produce an adhesive agent. This agent is then filtered, degassed, and cast onto a stainless steel drum with carrier cloth and release paper to form a self-supporting film. The final product undergoes heating and annealing to achieve the desired properties. This invention is particularly applicable in industries requiring high temperature resistant materials.
Career Highlights
Throughout his career, Haidong Yang has demonstrated a commitment to advancing material technologies. His innovative approaches have led to practical solutions that enhance the performance of adhesive materials in high-temperature environments. Yang's expertise in this niche area has positioned him as a valuable contributor to the field.
Collaborations
Haidong Yang has collaborated with notable colleagues, including Changwei Liu and Wanbao Xiao. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and expertise, further enhancing the quality of their innovations.
Conclusion
Haidong Yang's contributions to the development of heat resistant polyimide films exemplify the impact of innovation in materials science. His patents not only address existing challenges but also pave the way for future advancements in high-temperature applications.
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