Shenzhen, China

Hai Tao Xiu

This inventor holds 1 USPTO granted patent. Top assignee: Siemens Corporation. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Hai Tao Xiu. Retrieved from https://idiyas.com/inventor/hai-tao-xiu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Innovations of Hai Tao Xiu in Superconducting Technology

Introduction

Hai Tao Xiu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of superconducting technology, particularly through his innovative patent related to thermal radiation shielding.

Latest Patents

Hai Tao Xiu holds a patent for a thermal radiation shield designed for superconducting magnets and magnetic resonance imaging devices. This invention features an inner tube and an outer tube arranged around the periphery of the inner tube, with an annular end cap connecting them in a fixed manner. The design includes a first toothed part at the outer edge of the annular end cap, which meshes with a second toothed part formed by the edge of the outer tube. This innovative toothed structure simplifies the manufacturing process, allowing for a straightforward cutting process on raw materials, thus reducing production costs.

Career Highlights

Hai Tao Xiu is currently employed at Siemens Corporation, where he continues to develop and refine his inventions. His work has garnered attention for its practical applications in advanced technologies.

Collaborations

He collaborates with notable colleagues, including Li Huang and Edward Wedderburn Kershaw, contributing to a dynamic and innovative work environment.

Conclusion

Hai Tao Xiu's contributions to superconducting technology exemplify the impact of innovative thinking in engineering. His patent not only advances the field but also demonstrates the importance of cost-effective manufacturing processes.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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