This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignee: Qualcomm Incorporated. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Hagen Spies
Introduction
Hagen Spies is a notable inventor based in Stockholm, Sweden. He has made significant contributions to the field of image processing and machine learning. With a total of 2 patents, his work focuses on enhancing the capabilities of image sensors.
Latest Patents
Hagen's latest patents include "Extrinsic parameter prediction for image sensor(s)" and "Online intrinsic calibration." The first patent provides techniques for extrinsic parameter prediction, particularly for cameras. This method involves obtaining a first frame for a specific time period, processing it with a machine learning model, and determining the relative pose of the image sensor. The second patent outlines systems and techniques for calibrating image processing. It describes how a computing device can obtain image frames of a three-dimensional scene, determine inlier points, and apply final intrinsic parameters to the camera.
Career Highlights
Hagen Spies is currently employed at Qualcomm Incorporated, where he continues to innovate in the field of image processing. His work has implications for various applications, including computer vision and robotics.
Collaborations
Hagen collaborates with talented individuals such as Bjoern Johansson and Daniel Ankelhed. Their combined expertise contributes to the advancement of technology in their field.
Conclusion
Hagen Spies is a prominent inventor whose work in image processing and machine learning has led to valuable patents. His contributions continue to shape the future of technology in significant ways.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
